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Bijan Davari received his M.S and Ph.D. degrees in electrical engineering from Rensselaer Polytechnic Institute, Troy, NY in 1984. He then joined IBM Research, Thomas J. Watson Research Center, Yorktown Heights, NY, where he worked on various aspects of scaled CMOS and BiCMOS technologies, including device scaling and process integration. He defined and developed a selectively scaled 0.25 micron CMOS technology at 2.5V, demonstrating significant performance and power reduction improvement over CMOS technologies at 3.3V. This work has set the direction and the supply voltage for the post 3.3V CMOS generations.
Dr. Davari was appointed IBM Fellow in 1996 because of his leadership in CMOS technology scaling. According to the citation, "His work has profoundly influenced both the logic technology in current IBM systems and the direction of ongoing CMOS research, leading the way to high-performance and low-power."
In 1998 he was appointed vice president of Technology and Emerging Products, leading IBM's Semiconductor Research and Development Center (SRDC) in Hopewell Junction, NY. His team has been responsible for the definition and development of industry leading technologies such as Copper Interconnect, Silicon on Insulator (SOI), High-Performance Logic-Based Embedded DRAM technologies, and SiGe for RF and analog applications. SRDC is also the leading organization in defining the most advanced technologies for the 65nm and 45nm nodes, including research in various aspects of Lithography, strained silicon, and Magnetic RAM (MRAM). Dr. Davari's current responsibilities include the IBM alliance with SONY and Toshiba, aimed at defining the post-PC architecture "CELL" in Austin, Texas. SRDC has also forged major new alliances in process technology with SONY, Toshiba, AMD, Chartered and Infineon within the last two years.
In August 2003, he was named vice president of Next Generation Computing Systems/Technology. In this new job, Bijan will help to create a leadership semiconductor, systems and software technology strategic plan for our end of the decade systems. He will join Tilak Agerwala and Rick Baum on the executive leadership team for the DARPA/PERCS program and will help integrate the systems work in that program with our advanced semiconductor technologies. This is an exciting opportunity to bring together our systems, technology and software research and development efforts.
He has authored and co-authored over 70 publications in various aspects of semiconductor devices and technology and is an IEEE fellow.
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