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Dr. Edelstein is an IBM Fellow and Program Manager of Cu/Low-k CVD BEOL at IBM's T. J. Watson Research Center in Yorktown Heights, New York. He received B.S., M.S., and Ph.D. degrees in Applied Physics from Cornell University. His thesis work involved ultrafast quantum electronics and the invention of the first femtosecond optical parametric oscillator. At IBM, he has worked on advanced interconnect technologies and System on Package concepts for VLSI/ULSI applications. This work spans a range of interconnect and package-related issues such as process integration, advanced materials development, reliability, electrical performance modeling, interconnect scaling, new passive devices, dielectric and high-speed measurements, and hybrid technology integrations. In general these were applied to research and development of Cu and Cu/Low-k (SiCOH)on-chip interconnects and BEOL devices. Dr. Edelstein played a leadership role in the development and implementation of IBM's industry-first "Cu Chip" technology, and more recently led the development of IBM's Cu/SiCOH low-k BEOL for the 90 nm CMOS node. Currently he leads strategic BEOL Research and Development projects for 45 nm node, Cu/ultralow-k integration, and other advanced BEOL elements. He currently holds 68 U.S. patents, has coauthored more than 90 external publications, has received four IBM Corporate Awards including the IBM Fellowship, and was co-recipient of the 2006 New York State Intellectual Property Law Association's "Inventor of the Year" award.
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