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STM image: 28nm by 28nm area of the terraced copper and copper nitride surface


 


STM image: 28nm by 28nm area of the terraced copper and copper nitride surface
STM image of 28nm by 28nm area of the terraced copper and copper nitride surface where the IBM experiments were performed. The smooth flat surfaces are copper metal; the cross-hatched, slightly depressed areas are patches of insulating CuN, which were created by implanting a sub-monolayer amount of nitrogen and heating the surface. The scientists wanted both sufaces close to each other so they could easy test magnanese-atom structures on both the conducting and insulating surfaces. The visible humps on the surfaces are the manganese structures (1-10 atoms long)
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