The Electrical Interconnect and Packaging project is working on providing leadership packaging for supercomputers, servers, and client machines. We provide best-of-breed designs and simulation tools, develop new characterization techniques, develop leading-edge thermal and mechanical solutions for IBM servers. We also build systems to explore the peak supercomputer performance obtainable using new architectural concepts, and we support supercomputing on existing high-end IBM machines.
Electrical Interconnect and Packaging
Research Area