About me
Manager, Interconnect and Packaging Analysis Project
Research lab: Watson Research Center (Yorktown)
Group: Advanced Server Hardware Systems
Department: Exploratory Server Systems
Research Interests:
Design, analysis, and measurement of packaging and VLSI chip interconnections for future digital processor and communication applications. Work involves the three dimensional modeling, signal integrity, and noise simulation and testing of a large range of package lossy transmission lines, from printed-circuit boards, cables, connectors, to thin-film wiring on multi-chip modules and on-chip wiring.
Manages:
Modeling, simulation, measurement, design, and development of best-of-bread full-wave electromagnetic field solver tools for analysis of complex, high-performance electrical integrated systems, such as full-chip or full-system to afford multi-GHz operation: signal and noise integrity for on-chip wiring, cards, boards, cables; developement of CAD interfaces, modeling methodologies, material characterization, optimization methodologies for on-chip and on-package, parallelization on distributed and shared memory cluster for very large problem solutions; multi-physics modeling and optimization such as electro-thermal analysis.
Last updated 13 Jun 2008