About me
Engineer, package design and analysis
Research lab: Watson Research Center (Yorktown)
H. Randall Bickford is an engineer in the Package Design and Analysis group at the IBM T.J. Watson Research Center. He holds degrees in Chemical Engineering and Materials Science and Mechanical Engineering. His research activities have included development of miniaturized packages for Josephson technology, bonding techniques and advanced structures for low cost packaging, chemical modification of fluoropolymer materials, patterned dielectric planarization, and copper metallization. Since 1995 he has worked in the area of systems packaging, focussing on high performance circuit card improvements through enhanced interface circuit designs and layout, as well as, the analysis of signal integrity issues for critical interconnection net structures, most recently for the BlueGene/L supercomputer. He is the co-holder of 18 US patents.
Last updated 9 Jun 2006