The 60-GHz band is a free/unlicensed band which features a large amount of bandwidth and a large worldwide overlap. The large bandwidth means that a very high volume of information can be transmitted wirelessly. The large worldwide overlap results in interoperability around the globe. Multiple applications can benefit from this--wireless HDTV; wireless laptop docking stations; extremely fast downloading of files via wireless Gigabit Ethernet, wireless USB 2.0, or other protocols; wireless telecommunications backhauls, etc. More information on 60-GHz applications can be found here.
Since 2003, IBM Research has been working on the development of 60-GHz radio transceiver integrated circuits (ICs) and the surrounding infrastructure to enable low-cost 60-GHz communications. This work was originally funded by NASA as a technology for inter-satellite links. It is now being funded by DARPA, broadening the work to include other bands and other enablements.
IC design
In 2004, we demonstrated the world’s first silicon-based active mixers and low-noise amplifiers at 60 and 77 GHz, and also demonstrated other mmWave radio building blocks, including power amplifiers and voltage-controlled oscillators. This work proved that it is feasible to build silicon mmWave circuits. Refer to our publications for more detail (best paper awards at 2004 and 2006 ISSCC).
In early 2006, we have demonstrated a fully integrated 60-GHz receiver and transmitter chipset, which includes all of the RF and analog portions of the radio. In addition, we have demonstrated low-cost packaging and antennas. These packaged chips have been demonstrated at 630 Mbps throughput at a maximum range of ten meters. These chips achieve what could be the highest level of integration for any millimeter-wave chip. Their complexity is approaching that typically seen in silicon at much lower frequencies. The high level of integration and the low-cost packing together will enable low-cost, high-performance 60-GHz communications.
Package and Antenna Development
In addition to the IC development, we are also developing low-cost mmWave packaging techniques and 60-GHz antennas, as the package plays a key role in the overall system performance and cost. We have characterized various packaging materials (molds, underfills, encapsulants, substrates…) at mmWave frequencies. We are exploring chip-on-board packaging, plastic packaging, and even standard “split-block” packaging.
Our most comprehensive and aggressive package embeds the antenna directly within it. This provides a single-package mmWave solution, allowing customers to integrate mmWave functionality into their products using existing skills and equipment. Below are two pictures showing a chip attached directly to a board, and the complete chipset integrated in a plastic package together with two 60-GHz antennas. The size of the package is roughly that of a US dime.
Channel Sounding
IBM has sounded multiple wireless channels at 60-GHz and has developed a statistical model for the 60-GHz channel. This data has been shared with the 802.15.3c working group.
Standardization
The IEEE 802.15.3c working group was formed in 2005 to standardize the use of the 60-GHz band.