IBM Journal of Research and Development
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Related Papers
2005Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
2005Recent developments in high-moment electroplated materials for recording heads
2000Characterization of constitutional liquid film migration in nickel-base alloy 718
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1982Optimization of Indium-Lead Alloys for Controlled Collapse Chip Connection Application
1966Surface Attack in Chromium-Iron Alloys
1960Angle-of-Incidence Anisotropy in Evaporated Nickel-Iron Films
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1960The Influence of Edge Effects on Domain Structure and Coercive Force of Circular Nickel-Iron Films