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2000	The future of interconnection technology
1998	Damascene copper electroplating for chip interconnections
1993	Anodic dissolution of metals at high rates
1993	Attachment of Solder Ball Connect (SBC) packages to circuit cards
1984	Immersion tin: Its chemistry, metallurgy, and application in electronic packaging technology
1984	Microstructure evolution during electroless copper deposition
1971	A Design Study of Ultrasonic Bonding Tips
1970	Indium-mercury Alloy as a Low-toxicity Liquid Electrode
1970	Reduction of Electromigration in Aluminum Films by Copper Doping
1969	Controlled Collapse Reflow Chip Joining
1969	Geometric Optimization of Controlled Collapse Interconnections
1969	Parametric Study of Temperature Profiles in Chips Joined by Controlled Collapse Techniques
1969	Reliability of Controlled Collapse Interconnections
1969	SLT Device Metallurgy and its Monolithic Extension
1969	Studies of the SLT Chip Terminal Metallurgy
1968	New Annealing Effects on the Bulk Corrosion Potential of Germanium
1967	Precipitation of Phosphorus, Arsenic, and Boron in Thin Silicon Foils
1966	Surface Attack in Chromium-Iron Alloys
1965	Fatigue Strength of Case Hardened Steel Specimens Containing Through-The-Case Cracks
1965	Sheet Thermoforming of a Superplastic Alloy
1963	Prenucleation of Lead Films with Copper, Gold, and Silver
1962	Direct Observations of the Substructure Network in Iron
1959	Application of Phase-Contrast Metallography in a Production Laboratory
1957	Microsectioning: A Metallographic Technique for Semiconductor Devices