IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Search/Index  
    Orders  
    Description  
    Patents  
    Recent publications  
    Author's Guide  
  Staff  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 16, Number 3, Page 303 (1972)
Mechanical Technology
  Full article: arrowPDF   arrowCopyright info





   

Analytical and Experimental Thermal Analysis of Multiple Heat Sources in Integrated Semiconductor Chips

by R. D. Lindsted, D. A. DiCicco
Because of the complexity and interconnection density of today's integrated circuit chips, experimental measurement of individual transistor or diode junction temperatures under typical powered conditions has become increasingly difficult. In order to provide meaningful thermal data, other approaches have had to be devised. In the work described by this paper, an analytical model has been used to determine the steady state junction temperature rise on an integrated circuit chip. The effect on junction temperature of heat source size, geometry, and number of adjacent heat sources has been studied. Experimental testing on specially prepared chips has verified the analytical results.
Related Subjects: Mechanics and mechanisms; Microelectronics; Semiconductor devices; Thermodynamics