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IBM Journal of Research and Development  
Volume 49, Number 4/5, Page 641 (2005)
POWER5 and Packaging
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The evolution of build-up package technology and its design challenges

by E.D. Blackshear, M. Cases, E. Klink, S.R. Engle, R.S. Malfatt, D.N. deAraujo, S. Oggioni, L.D. Lacroix, J.A. Wakil, N.H. Pham, G.G. Hougham, D.J. Russell
This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988 and reports on developments in this technology for IBM applications since its adoption in 2000. The laminated substrates are nonuniform structures composed of three elements: a core, build-up layers, and finishing layers. Each element has evolved to meet the demands of packaging applications. Thin-film processing has greatly enhanced the wiring capability of SBU laminate substrates and has made this technology very suitable for high-performance designs. This paper focuses on the challenges at IBM and their corresponding solutions in using SBU laminate substrates encountered during the design, manufacture, and reliability-testing phases associated with application-specific integrated circuit (ASIC) and microprocessor designs.
Related Subjects: Materials technology; Multilayers; Packaging; Process control and development