IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Search/Index  
    Orders  
    Description  
    Patents  
    Recent publications  
    Author's Guide  
  Staff  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 31, Number 4, Page 489 (1987)
Aspects of Computer Performance
  Full article: arrowPDF   arrowCopyright info





   

Signal degradation through module pins in VLSI packaging

by C.-C. Huang, L. L.-H. Wu
This paper investigates chip-to-chip communication through the modules and board in VLSI packaging. Transmission line models and frequency-dependent transmission line parameters are used in finding the frequency response. The time-domain solution is then obtained through the inverse Fast Fourier Transform. The results show that uncoated module pins, even of relatively short length, can cause severe signal degradation because of their magnetic property. The signal behavior is improved dramatically, however, when the module pins are coated with nonmagnetic conductive material.
Related Subjects: Packaging; VLSI