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IBM Journal of Research and Development  
Volume 29, Number 1, Page 87 (1985)
Nontopical Issue
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The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions

by C. H. Stapper
A method for modeling the variations in defect levels in circuits produced on modern integrated circuit manufacturing lines is described in this paper. The effects on defect and fault distributions are derived. A deficiency in some previous yield models is eliminated.
Related Subjects: LSI; Manufacturing; Quality control; Semiconductor technology; Statistics