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IBM Journal of Research and Development  
Volume 26, Number 3, Page 278 (1982)
Computer Packaging
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Cost/Performance Single-Chip Module

by D. J. Bendz, R. W. Gedney, J. Rasile
The introduction of the high performance T2L device technology for the IBM 4300 Systems and the System/38 required extensions of the 24-mm metallized ceramic module used in prior IBM systems. The extension of the metallized ceramic technology into a physically larger 28-mm module, electrically enhanced with a reference plane and with fine line (0.025-mm) wiring, is described. The reliability of this module was evaluated with particular emphasis on corrosion and metal migration in humid environments and on exposure to atmospheric contaminants.
Related Subjects: Integrated circuit design; LSI; Materials; Reliability